Heraeus AlSi:Pads – solderable and adhesive bond pads
Heraeus bond preforms make circuit board designs more reliable and flexible. When soldered onto PCBs and ceramic hybrids, they allow for the automated application of additional and reliable bond isles.
The bond pads are characterized by an excellent electrical and thermal conductivity and enable complex functionalities and freedom of design in the tiniest space. With these advantages, they are mainly used in the automotive and high-end segment where miniaturisation and growing requirements play an ever-increasing role.
Profit from our customer-specific advice. Together we will find the optimal configuration and material combination for your application.
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Our solderable and adhesive bond preforms offer a particularly high level of conductivity with optimal use of space.
Your benefits:
Our service for you:
Together we can develop the best possible solution for your application.
Heraeus bonding pads are used to connect bond elements on PCBs and ceramic hybrids. The mono-metal connection with Al wires has been proven worldwide in millions of cars and high-end applications.
Materials:
We process further material combinations for you upon request.
Dimensions:
We mass produce the following standard dimensions (very good availability):
Contact us for other, customized dimensions.
Packaging Information: